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J1 SMT Stencil cleaning rolls
For use to remove residual solder paste from the bottom side of PCB stencils.

Product Introduction Feature

Basis weight: 40gsm;56gsm;65gsm;

Sizes: 300mm×10m;400mm×10m;515mm×10m;

Packaging: 1 roll/bag, 25 rolls/case;


Other dimensions and packaging are available on specific request.

Spun-laced non-woven polyester fiber/wood pulp wipe,provides low contamination on economical price; 

No binders or other chemical additives;

Low particulate and fiber release;

Add: 深圳市宝安区西乡街道龙腾社区汇智研发中心A座2501及整层 / Room 2501 and the entire 25th Floor, Tower A, Huizhi R&D Center, Longteng Community, Xixiang Subdistrict, Bao'an District, Shenzhen, Guangdong, China
+86 755 27806543#8050
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