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J1 SMT Stencil cleaning rolls
For use to remove residual solder paste from the bottom side of PCB stencils.

Product Introduction Feature

Basis weight: 40gsm;56gsm;65gsm;

Sizes: 300mm×10m;400mm×10m;515mm×10m;

Packaging: 1 roll/bag, 25 rolls/case;


Other dimensions and packaging are available on specific request.

Spun-laced non-woven polyester fiber/wood pulp wipe,provides low contamination on economical price; 

No binders or other chemical additives;

Low particulate and fiber release;

Add: Building A3,Zedali Industrial Park, Zhancheng Community, Fuhai Street, Baoan District, Shenzhen, China, 518103
+86 755 27806543#8050
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